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  3. Huawei Ascend Y550, LeEco Le 2 Pro X25, Highscreen Tasty, HiSense M30,

Compare phones and smartphones: Huawei Ascend Y550 vs LeEco Le 2 Pro X25 vs Highscreen Tasty vs HiSense M30 vs


0.23
HUAWEI ASCEND Y550
Huawei Ascend Y550
0.1
0.2
0.85
1.13
0.09
1.19
1.17
8.03
no shops
N/A
Display Size4.5 Inch
Display TypeIPS
Display Area61.9%
Display Density218 PPI
Thickness9.5 mm
Weight153 gram
OsAndroid 4.4.2 KitKat
SocQualcomm Snapdragon 410 MSM8916
Cpu Cores4 Cores
Cpu Frequency1200 MHz
Ram1 gigabyte
Rom4 gigabyte
Sensor Type
Image Resolution5.04 Megapixels
Image Resolution0 Megapixels
Capacity2000 mAh
2.04
LEECO LE 2 PRO X25
LeEco Le 2 Pro X25
5.33
1.33
5.69
2.59
3.11
3.98
1.35
0.32
no shops
N/A
Display Size5.5 Inch
Display TypeIPS
Display Area74.62%
Display Density401 PPI
Thickness7.5 mm
Weight153 gram
OsAndroid 6.0.1 Marshmallow
SocMediaTek Helio X25 (MT6797T)
Cpu Cores10 Cores
Cpu Frequency2500 MHz
Ram4 gigabyte
Rom32 gigabyte
Sensor TypeCMOS (complementary metal-oxide semiconductor)
Image Resolution21.16 Megapixels
Image Resolution7.99 Megapixels
Capacity3000 mAh
0.17
HIGHSCREEN TASTY
Highscreen Tasty
0.35
0.48
1.49
0.54
0.46
2.45
1.23
0.13
no shops
N/A
Display Size5 Inch
Display TypeIPS
Display Area67.06%
Display Density294 PPI
Thickness8.1 mm
Weight137 gram
OsAndroid 5.1 Lollipop
SocMediaTek MT6735
Cpu Cores4 Cores
Cpu Frequency1300 MHz
Ram3 gigabyte
Rom16 gigabyte
Sensor TypeCMOS (complementary metal-oxide semiconductor)
Image Resolution7.99 Megapixels
Image Resolution4.92 Megapixels
Capacity2400 mAh
0.16
HISENSE M30
HiSense M30
0.17
0.2
0.3
1.95
0.46
1.88
1.35
0.49
no shops
N/A
Display Size5 Inch
Display TypeIPS
Display Area67.06%
Display Density294 PPI
Thickness9 mm
Weight150 gram
OsAndroid 6.0 Marshmallow
SocQualcomm Snapdragon 210 MSM8909
Cpu Cores4 Cores
Cpu Frequency1100 MHz
Ram1 gigabyte
Rom8 gigabyte
Sensor TypeCMOS (complementary metal-oxide semiconductor)
Image Resolution5.04 Megapixels
Image Resolution1.92 Megapixels
Capacity2000 mAh

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