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  3. Tengda N5, Philips Xenium W3500, Highscreen Power Ice Evo, ZTE Blade Max 3,

Compare phones and smartphones: Tengda N5 vs Philips Xenium W3500 vs Highscreen Power Ice Evo vs ZTE Blade Max 3 vs


0.06
TENGDA N5
Tengda N5
0.35
0.25
0.19
0.06
0.17
2.72
1.17
0.07
no shops
N/A
Display Size5.5 Inch
Display TypeTFT
Display Area72.43%
Display Density200 PPI
Thickness8.72 mm
Weight177 gram
OsAndroid 4.4.2 KitKat
SocMediaTek MT6582W
Cpu Cores4 Cores
Cpu Frequency1300 MHz
Ram1 gigabyte
Rom8 gigabyte
Sensor Type
Image Resolution7.99 Megapixels
Image Resolution4.92 Megapixels
Capacity2200 mAh
0.03
PHILIPS XENIUM W3500
Philips Xenium W3500
0.14
0.25
0.22
0.06
0.09
1.56
1.14
0.43
no shops
N/A
Display Size5 Inch
Display TypeTFT
Display Area66.04%
Display Density196 PPI
Thickness9.65 mm
Weight170 gram
OsAndroid 4.2.2 Jelly Bean
SocMediaTek MT6582
Cpu Cores4 Cores
Cpu Frequency1300 MHz
Ram1 gigabyte
Rom4 gigabyte
Sensor Type
Image Resolution4.46 Megapixels
Image Resolution1.81 Megapixels
Capacity2200 mAh
0.65
HIGHSCREEN POWER ICE EVO
Highscreen Power Ice Evo
0.41
7.73
0.39
0.54
0.46
2
1.35
0.13
no shops
N/A
Display Size5 Inch
Display TypeIPS
Display Area67.02%
Display Density294 PPI
Thickness8.69 mm
Weight158 gram
OsAndroid 6.0 Marshmallow
SocMediaTek MT6737
Cpu Cores4 Cores
Cpu Frequency1250 MHz
Ram2 gigabyte
Rom16 gigabyte
Sensor TypeCMOS (complementary metal-oxide semiconductor)
Image Resolution7.99 Megapixels
Image Resolution4.92 Megapixels
Capacity5000 mAh
1.77
ZTE BLADE MAX 3
ZTE Blade Max 3
2.71
3.75
2.43
1.72
4.1
2.97
1.35
3.76
no shops
N/A
Display Size6 Inch
Display TypeIPS
Display Area72.06%
Display Density367 PPI
Thickness8.9 mm
Weight179 gram
OsAndroid 6.0.1 Marshmallow
SocQualcomm Snapdragon 625 MSM8953
Cpu Cores8 Cores
Cpu Frequency2000 MHz
Ram2 gigabyte
Rom16 gigabyte
Sensor TypeCMOS (complementary metal-oxide semiconductor)
Image Resolution12.98 Megapixels
Image Resolution4.92 Megapixels
Capacity4000 mAh

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